PCHE manufacturer Europe
Printed circuit heat exchangers and microchannel thermal solutions.
Microchannel Devices began as a manufacturer of chemically etched plates and has since developed a fully integrated in-house value chain. Building on this core technology, we have expanded our expertise to include the design of microchannel products and advanced diffusion bonding processes, enabling us to offer a comprehensive range of high-performance solutions.
PCHE — Printed Circuit Heat Exchangers
Printed Circuit Heat Exchangers (PCHEs) designed for operating conditions beyond the limits of conventional heat exchanger technologies: high pressures, temperatures ranging from cryogenic to extremely high values, and multistream configurations involving multiple process fluids within a single core.
Available materials include stainless steel, titanium, and aluminium. ASME Section VIII U-Stamp certification, including lethal service applications, is available across the entire product range, together with PED compliance for the European market.
Microchanneled devices
Microchanneled cores for applications that require fluid flow through complex geometries and non-standard configurations: biochemical reactors, CO₂ conversion and capture devices, marine applications and confined-space installations. Cores are supplied either simply stacked with tack welding, or fully diffusion bonded into a leak-proof monolithic block. Internal simulation tools are used to optimize channel geometry, flow distribution and pressure drop for every specific configuration.
Microchanneled plates
Semi-finished components in stainless steel, aluminium, titanium and copper, with chemically etched channels produced to client technical specifications. Thickness from 0.2 to 5 mm, width up to 850 mm, length up to 3,000 mm. Channel geometry is fully customisable — width 0.4–6 mm, depth 0.2–3 mm — and includes manifolds and through-holes for plate-to-plate fluid connections. The product of choice for heat exchanger manufacturers who manage the bonding process in-house.
Cold/Hot Plates
Liquid-cooled heat sinks for high-power-density electronics, with channel depth down to 1 mm and an extremely compact footprint. Available materials include stainless steel, aluminium alloys and copper. Target markets include data centres, aerospace, rail transport, semiconductors, UPS systems and defence applications.
Custom PCHE and microchanneled devices
From design to product.
We design and manufacture high-performance heat exchangers entirely in-house, managing every stage of the process, from chemical etching to diffusion bonding.
Our capabilities include the production of chemically etched plates, heat exchanger cores, and PCHEs (Printed Circuit Heat Exchangers). We also provide heat treatment services for diffusion bonding and other high-temperature material processing applications.
PCHE solutions supplied worldwide
Manufacturing aligned with ISO and ASME standards
End-to-end in-house diffusion bonding and production
microchannel devices
Advanced PCHE and microchanneled thermal solutions for extreme operating conditions.
Working temperatures and pressures can span from very low to very high limits
The entire production cycle — from channel geometry engineering to final product delivery — takes place in a single 5000+ m² facility in Settimo Torinese, with no outsourcing and no intermediate steps that introduce uncontrolled variables.
ASME U certified (N° 59571), custom dimensions from very small to very large size, multistream capability across the full PCHE range.
Quality, safety and compliance.
Our organization is committed to quality, environmental responsibility and occupational safety, supporting customers in industries where reliability and compliance are essential. Microchannel Devices is certified by DEKRA Testing and Certification S.r.l. (ACCREDIA accredited) for all three ISO standards and holds ASME authorisation for the manufacture of pressure vessels.
The company has also signed the Charter for Equal Opportunities and Equality at Work promoted by Fondazione Sodalitas, reaffirming its commitment to diversity and to the elimination of all forms of discrimination in hiring, training and career development.
PCHE manufacturer in Europe
microchannel devices apart.
WHY Microchannel Devices?
Because the whole process happens under one roof.
We etch plates larger in width and length than any competitor — up to 850 × 3000 mm — and build PCHE cores engineered for extreme conditions: pressures above 900 bar, temperatures from −200 °C to +900 °C, hydrostatic testing up to 2000 bar, including lethal service in Oil & Gas. Diffusion bonding turns the stacked plates into a single monolithic block with the strength of the parent material: no brazing, no gaskets, no external welds. Maximum performance in minimum space — up to 85% smaller and lighter than traditional heat exchangers, with ~98% thermal efficiency.
Because quality is certified, not claimed.
WHY Microchannel Devices?
Because our expertise runs deep.
A young company built on more than 50 years of chemical etching know-how from STV Group, with dedicated R&D programs on diffusion welding — including 3 patents — and on hydrogen applications, in collaboration with PoliTO, IIT and MESAP.
More than 20% of total capex goes into R&D.
Because we engineer with you, not just for you.
Every device is bespoke. Our engineers work alongside your team to develop the most efficient solution —including architectures an integrated process makes possible: multistream PCHE, hybrid PCHE, cold plates. And because the full chain is ours, we move at a speed others cannot match.
WHY Microchannel Devices?
Because we go where others stop.
We etch plates larger in width and length than any competitor — up to 850 × 3000 mm — and build PCHE cores engineered for extreme conditions: pressures above 900 bar, temperatures from −200 °C to +900 °C, hydrostatic testing up to 2000 bar, including lethal service in Oil & Gas. Diffusion bonding turns the stacked plates into a single monolithic block with the strength of the parent material: no brazing, no gaskets, no external welds. Maximum performance in minimum space — up to 85% smaller and lighter than traditional heat exchangers, with ~98% thermal efficiency.
WHY Microchannel Devices?
Because efficiency is our contribution to the energy transition.
From hydrogen to nuclear, carbon capture, LNG and data-center cooling, our microchannel technology transfers more heat in less space with less material — cutting energy consumption and CO₂ across the industries building tomorrow's energy systems.
Microchannel applications across advanced energy and industry.
Global demand for PCHE is growing for structural reasons: hydrogen production and distribution utilization, LNG as a bridge in the energy transition, and the deployment of small modular reactors (SMR) and many others.
All of these markets converge on the same technical requirement: compact, certified heat exchangers capable of operating under extreme conditions and available on timelines that match project schedules.
Microchannel Devices fills the technical and operational space these players cannot cover with the same speed and depth of customisation: a fully integrated production cycle — with larger dimensions available on request — and an engineering team accessible from the first technical call.
We support hydrogen-related applications with compact, high-performance thermal solutions designed for production, distribution and utilization systems. Our devices help manage heat efficiently in processes where temperature control, reliability and reduced footprint are critical.
Our heat exchangers are suited for liquefaction, evaporation and gas treatment applications, where compactness, thermal efficiency and resistance to demanding operating conditions are key. Microchanneled solutions can help optimize process performance while reducing space requirements.
We develop thermal solutions for advanced energy systems and high-efficiency thermodynamic cycles, supporting applications where performance, heat recovery and process optimization play a central role. Our technologies are designed to improve thermal exchange in compact and highly engineered systems.
Microchannel Devices works on high-integrity thermal solutions for advanced nuclear applications, including systems that require precision manufacturing, robust process control and reliability under demanding operating conditions. This includes components for primary, secondary and decay heat management duties.
Our microchanneled devices are designed to support emerging carbon capture processes where compactness, efficiency and tailored thermal-fluidic performance are important. We work with customers on custom solutions for next-generation decarbonization technologies and CO2-related applications.
We develop cold plates and advanced cooling solutions for high-density heat dissipation, helping improve thermal management in systems where performance, reliability and space optimization are increasingly important. These solutions are particularly relevant for next-generation digital infrastructure and high-power electronics.
our process
Process integration as a technical advantage.
In the PCHE and microchanneled device space, an integrated production chain is not a commercial argument — it is a technical condition that directly affects channel dimensional repeatability, bond joint quality and final conformance to project specifications.
Every handoff to a subcontractor — for etching, for diffusion bonding, for testing — introduces additional tolerances that accumulate through the process. Microchannel Devices is one of the few European manufacturers that performs both core processes under one roof, with the same engineering team, on the same certified production line.
Full in-house process
Chemical etching diffusion bonding, post processing and testing take place in a single production facility, with direct control over every critical parameter: geometrical, diffusion bonding process, performance, cleanliness.
Full process control with no dependency on external treatment unable our zero defect policy.
Built for complexity
Fast & flexible
our process
From Drawing to plate.
Development of a new geometry starts from the client’s technical specification — or, when it is not yet defined, from a technical call with MCD’s engineering team.
Critical parameters are discussed directly: material, thickness, channel width and depth, cross-section profile, manifold position and dimensions, required tolerances, surface treatments, qualification documentation.
Before series production, MCD runs a qualification cycle on a sample: the etched geometry is dimensionally verified, tolerances are documented and the sample is approved with the client. Series production begins only after that sign-off.
It is the same approach MCD applies to its own PCHE: co-engineering from specification, not adaptation of a standard product.
Whether it is a prototype for a test campaign, a small series for an R&D project or a recurring supply for series production, the Microchannel Devices engineering team evaluates technical and manufacturing feasibility from the first enquiry.
Direct access, from the start: engineers working with engineers, from channel geometry to delivery.
