diffusion bonding

Diffusion bonding is a solid state welding process by which prepared surfaces are joined at high temperature and under applied pressure. Temperatures required for the process are usually in the range (0.7-0.8) of absolute melting point of the material, pressures are typically some small fraction of the room temperature yield stress, times can vary from a few minutes to several hours.

Main features

• High quality joints: strength and ductility equivalent to those of the parent material

• High precision components with complex shapes

• Possibility to have Integrated collectors

• No brazing, no external welds, no gaskets

• Joining of different materials

• Bigger furnace then typical diffusion bonding ones (HUP Technology)

µCD has the biggest horizontal HIP furnace in Europe under dedicated specifications.

Thanks to this technology we can produce high aspect ratio PCHE cores (up to 800 x 800 x 2500 mm).